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DiaSec Diamond Wafering Blade - General Purpose Metallography 6in 25 lbs Made with an electroplated bonding

SKU: 8846125726

4.9
EUR175.00 EUR216.00

Pay in 4 interest-free payments of $43.75 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 5 - Aug 10

Description

Made with an electroplated bonding

Quantity: 1/pkg

CarbiPro SiC abrasive paper rolls are designed for metallurgical sample preparation

Diabrasive Premium is ideal for metallographic sample preparation and is suitable for polishing:

DiaSec Diamond Wafering Blade - General Purpose Metallography 6in 25 lbs Made with an electroplated bondingThe DiaSec General Purpose Diamond Blade is a must have for metallurgical sample preparation. Made with metal bonding, this 6in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert. Diameter: 6in (150mm) Thickness: 0. 024in (0. 6mm) Arbor: 0. 5in (12. 7mm) Item No DS 1006 1 pkg

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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